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Mechsense
01/01/22
During the of spring of 2022, I joined the HCIE Lab as an Undergraduate Researcher
I was part of a team who developed and tested the application of capacitance sensing from 3D printed mechanisms containing conductive filament.
I developed and tested the application of capacitance sensing from 3D printed mechanisms containing conductive filament with use of CAD software and specialised 3D printer filament.
Co-authored an ACM published research paper outlining the work.
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